SUMCO manufactures silicon wafers through an intricate, highly controlled process that begins with reducing high-purity polycrystalline silicon in a specialized crucible, pulling a flawless single-crystal silicon ingot using the Czochralski (CZ) crystal-growing method, slicing the ingot into thin circular wafers with precision saws, and subsequently lapping, etching, polishing, and cleaning them to achieve ultra-flat, defect-free surfaces.